Enfabrica Secures $125 Million in Series B Financing to Advance AI Infrastructure Networking Chips


Enfabrica Corporation, a rapidly growing startup specializing in converged networking and memory fabric silicon and software for the demands of artificial intelligence (AI) and accelerated computing workloads, has successfully concluded a Series B financing round, raising a substantial $125 million. Led by Atreides Management, the oversubscribed round significantly boosts Enfabrica’s valuation, which now exceeds five times its post-Series A valuation.

The financing will be utilized to further develop Enfabrica’s revolutionary Accelerated Compute Fabric Switch (ACF-S) devices and solutions, designed to address critical networking, I/O, and memory scaling challenges in data center AI and high-performance computing clusters. The company will be showcasing its ACF-S solutions at the AI Hardware and Edge AI Summit 2023.

Key Highlights:

  • The Series B funding round was oversubscribed and led by Atreides Management, with participation from existing investor Sutter Hill Ventures and new investors including NVIDIA, IAG Capital Partners, Liberty Global Ventures, Valor Equity Partners, Infinitum Partners, and Alumni Ventures.
  • Enfabrica intends to use the funds to expand its R&D and operations, further advancing the production of its flagship ACF-S devices. These devices promise a 50 percent reduction in the cost of computing and a 50-fold increase in memory expansion within GPU and accelerated compute clusters in data centers.
  • The successful Series B financing round has catapulted Enfabrica’s valuation to more than five times its post-Series A valuation.
  • Gavin Baker, Managing Partner & CIO of Atreides Management, has joined Enfabrica’s Board of Directors as part of the Series B financing, contributing to the company’s growth and strategic direction.

Enfabrica emerged from stealth mode earlier this year, unveiling its groundbreaking AI infrastructure interconnect chips known as Accelerated Compute Fabric devices. These devices offer unprecedented scalability, performance, and cost-efficiency for distributed AI, extended reality, high-performance computing, and in-memory database infrastructure.

Enfabrica’s 8 Terabit/second ACF switching system is now available for pre-order. It facilitates the direct attachment of GPUs, CPUs, CXL-attached DDR5 memory, and SSD storage to high-performance, multi-port 800-Gigabit-Ethernet networks. These systems incorporate Enfabrica’s high-performance ACF-S silicon with fully standards-compliant interfaces and networking software stack components.

The Enfabrica team, composed of Silicon Valley veterans with extensive experience at companies like Broadcom, Google, Cisco, AWS, and Intel, designed ACF devices to enable scalable, multi-terabit-per-second data movement between GPUs, CPUs, accelerators, memory, and networking devices. This solution promises a substantial reduction in the cost of compute for both LLM inferencing and DLRM inferencing while maintaining the same performance levels.

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